Soldering Auto Visual-Inspection Unit

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Soldering Auto Visual-Inspection Unit
「MS5000」　(Patent Pending)

(766kB)

Abnormal shapes of BGA soldered balls are distinguished by image data processing. and their results are calculated as numeric data.
After you set the substrate and click Start, the unit moves to the specified point at a fixed speed and pitch.
The unit is able to inspect the difference in the height of BGA soldering after a chip is mounted onto a substrate and then to store the difference data to a PC. As a result, you are able to know the inclination of a package.
You can inspect the soldered state of a package and separating them into OK and NG packages by graphically inspecting the following:
- the height of the ball soldering
- the interval between the balls
- the shape of the balls
The camera automatically moves to the NG part when you click the NG part data for your visual confirmation.

First set and register the camera position and the image processing parameters corresponding to the device. You can store up to 50 kinds of devices.

	The camera position can be manually set by looking at the camera image. You must input the ball pitch, the number of balls, and the interval between the balls to be inspected.
	Since you can set multiple parts for inspection at once, you can save a lot of inspection time. You can register the area enclosed by a red square as a template, and search for similar shapes to be measured. The image and data can be stored. You can store the image and data as a microscope image and data by adjusting the lighting on the microscope. The parts outside the range on the Inspection Result List are displayed in red. You can inspect the image of the part by clicking the red part. You can also set the unit so that it automatically stores an image of a defective part.

	Before you start the measurement of the BGA package, set the special prism on the microscope. The maximum width of the prism is about 45 mm and the minimum width is about 5mm. You can use three types of prisms depending on the thickness of the BGA package. The thinnest prism can be installed to a BGA package with only a space of 0.5 mm.
	Inquiry

MS5000
With Camera Lighting

MS5000
Without Camera Lighting

2D X-Ray

Normal ball

Abnormal ball – weak soldering

Difficult to differentiate between normal and abnormal ball

A problem in alignment
　

The abnormally standing balls are easily recognizable

The light and dark shadings are slightly shifted

A partial bridge

Defective alignment

	MS5000 ASS	MS5000 ASM
Main body specifications:
Range of motion	250 x 250mm	400 x 400mm
Maximum speed	200mm/sec
Optical specifications:
Lighting	LED
Camera	CCD　640 x 480
Telecentric Lens agnification	x 1.5
Range of view	3.2 x 4.2mm
Measurable package size	5 - 45mm corner
Minimum measurable ball diameter	About 70 microns
Minimum prism insertion space	0.5 mm (balls less than 0.3 mm)
PC specifications:
OS	Windows XP
CPU	Pentium 1.8GHz
System memory	1GB
Control specifications:
Drive system	Pulse motor
Operation method	PTP．CP
Number of control axes	4 Simultaneous axis
Control speed setting	1 - 1000mm/sec

※ We will accept your request for change of specification (in-line type etc.).