These products allows you to have the view soldering condition underneath BGA/CSP Soldering ball.
The patented original Microsquare BGA microscope was designed for solder joint by BGA, CSP.
We are developing and manufacturing for 10 years in Japan.
This picture took by MS1000LW with back light LED.
We use EMS or Fedex carier service depend on the situation. Shipping charge is included in the price.
We usually ship within 5 days after your order. Products will arrive at your location normally within 3 to 7days after shipment.
You can perform a visible check of the soldered ball surface, shape and filet shape.
You can also inspect interior section of the package by using the back light LED which is option.
This microscope enable you to inspect the lead section of a QFP Chip parts from the side view angle.
You can connect the microscope to either a PC or to a TV.